| 提高微波器件封装可靠性的工艺研究 |
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| 引用本文： | 庞学满,曹坤,唐利锋,夏庆水,王子良. 提高微波器件封装可靠性的工艺研究[J]. 固体电子学研究与进展, 2011, 31(4): 383-386 |
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| 作者姓名： | 庞学满 曹坤 唐利锋 夏庆水 王子良 |
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| 作者单位： | 1. 南京电子器件研究所,南京,210016
2. 南京电子器件研究所,南京, 210016 |
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| 摘 要： | 分析了微波外壳产生失效的主要原因,针对其在制备过程中的关键工艺以及技术难点展开讨论.分别论述了影响外壳可靠性的各个关键因素以及影响机理,包括瓷件尺寸精度和平整度、金属化强度与钎焊技术等,结合现有的工艺情况,分别提出相应的控制措施,并取得良好的效果.
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| 关 键 词： | 微波外壳 可靠性 封接强度 气密性 |
Research of Process for Microwave Package Reliability Improvement |
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| PANG Xueman,CAO Kun,TANG Lifeng,XIA Qingshui,WANG Ziliang. Research of Process for Microwave Package Reliability Improvement[J]. Research & Progress of Solid State Electronics, 2011, 31(4): 383-386 |
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| Authors: | PANG Xueman CAO Kun TANG Lifeng XIA Qingshui WANG Ziliang |
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| Affiliation: | PANG Xueman CAO Kun TANG Lifeng XIA Qingshui WANG Ziliang(Nanjing Electronic Devices Institute,Nanjing,210016,CHN) |
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| Abstract: | The dominating reason for microwave package failure was discussed in this paper.The key technical difficulty in preparation process was studied.Various factors affecting the reliability of package and their mechanism were discussed,including the dimension precision and the flatness of ceramic,the strength of metal and ceramic hang together,and sealing technology.Considering the process in practice,the corresponding resolving techniques making excellent effect were employed in this paper. |
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| Keywords: | microwave package reliability strength of sealing hermetic performance |
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