半导体冷箱制冷性能的数值模拟

建立了三维稳态计算模型,应用CFD软件模拟计算1台半导体冷箱样机在运行稳定后工作空间的温度场。通过数值计算得到实验工况的温度场,并且通过实验测量冷箱工作空间内6个特定点的温度值,测点的计算值与实测值能够较好地吻合验证了计算模型的准确性。在冷端分别采用强迫风冷换热、自然对流换热方式条件下,模拟计算冷端布置于5个不同位置时冷箱工作空间的温度场,这5个位置分别是冷箱内后侧壁的1/4,1/2,3/4高度(同时,在与高度垂直的另一个方向上,位于尺寸中心处),左侧壁中心位置以及顶部中心位置处。通过对各种情况下温度分布图的对比分析,认为冷端无论采用强迫风冷换热还是自然对流换热方式,将冷端布置在顶部中心位置均可使得温度分布最佳,同时肯定了在冷端装设风扇的必要性。

Numerical Simulation on Refrigeration Performance of a Semiconductor Freezer

A threedimensional steadystate numerical calculation model was made to calculate workspace tem perature fields of a semiconductor freezer after its stable running by using CFD software. Firstly, the temperature field under experimental conditions was calculated and the temperature of six specific points was measured. The re suits showed that the model is accurate for the two kinds of values. Secondly, the temperature fields of five different layout schemes for coldface were calculated under the condition of forced and natural aircooled convection was used for heat exchange on coldface respectively. The five schemes are the left lateralwall center, the top surface center, and 1/4,1/2,3/4 height of the back lateralwall inside the freezer, and they located in the center size of an other direction at the same time. The results showed that the top center is the best position for coldface because of its best temperature fields by comparing one kind of temperature field with another under the condition of ibrced and natural aircooled convection. Besides,it was suggested that a fan should be set with the coldface to get better re frigeration performance.