| 直流和脉冲Ni-ZrO2纳米复合电铸层显微硬度的研究 |
| |
| 引用本文： | 张文峰,朱荻.直流和脉冲Ni-ZrO2纳米复合电铸层显微硬度的研究[J].电镀与环保,2006,26(2):36-39. |
| |
| 作者姓名： | 张文峰 朱荻 |
| |
| 作者单位： | 南京航空航天大学,机电学院,江苏,南京,210016;苏州职业大学,机电系,江苏,苏州,215011;苏州职业大学,机电系,江苏,苏州,215011 |
| |
| 摘 要： | 利用SEM分析了纯镍电铸层,以及用直流和脉冲工艺所制备纳米复合电铸层的表面形貌,分别研究了影响直流和脉冲纳米复合电铸层显微硬度的各种因素,同时对纳米复合电铸层的强化机理进行了探讨.结果表明,纳米复合电铸层的表面形貌不同于纯镍电铸层,并且其显微硬度得到明显提高.纳米复合电铸层的强化机理主要是细晶强化机制、弥散强化机制和高密度位错强化机制.
|
| 关 键 词： | 复合电铸层 表面形貌 显微硬度 强化机理 |
| 文章编号： | 1000-4742（2006）02-0036-04 |
| 收稿时间： | 2005-09-28 |
| 修稿时间： | 2005年9月28日 |
A Research on Microhardness of Ni-ZrO2 Nano Composite Deposits Electroformed under Direct and Pulse Currents |
| |
| ZHANG Wen-feng,ZHU Di.A Research on Microhardness of Ni-ZrO2 Nano Composite Deposits Electroformed under Direct and Pulse Currents[J].Electroplating & Pollution Control,2006,26(2):36-39. |
| |
| Authors: | ZHANG Wen-feng ZHU Di |
| |
| Abstract: | The surface morphologies of purely electroformed Ni deposits and nano composite deposits electroformed under direct and pulse currents are analyzed by SEM.Various factors affecting the microhardness of nano composite deposits electroformed under direct and pulse currents are investigated,and its strengthening mechanism is also discussed.Results indicate that surface morphology of the nano composite electroformed deposits is different from that of purely electroformed Ni deposits,and the microhardness of nano composite electroformed deposits is markedly improved.The strengthening mechanism of nano composite electroformed deposits mainly involves fine-crystal,nanoparticle dispersion and dislocation effects. |
| |
| Keywords: | nano composite electroforming deposits surface morphology microhardness strengthening mechanism |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
