| 仿金电镀工艺的现状及发展前景 |
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| 引用本文： | 马雅琳,王云燕,秦毅红. 仿金电镀工艺的现状及发展前景[J]. 电镀与精饰, 1999, 21(3): 16-19 |
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| 作者姓名： | 马雅琳 王云燕 秦毅红 |
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| 作者单位： | 中南工业大学冶化研究所,长沙,410083 |
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| 摘 要： | 综合评术字高氰、中氰、低氰、微氰、无氰仿金电镀的镀液成分及工艺条件控制，并对仿金镀层的镀后处理工艺中的重铬酸钾钝化法和苯骈三氮唑（ＢＴＡ）钝化法进行了详细地对比。最后提出了仿金电镀目前存在的问题，并对其发展前景进行了展望 。
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| 关 键 词： | 仿金电镀 钝化 发展前景 |
| 修稿时间： | 1998－09－23） |
Technology Situation and Development Prospects of Imitation Gold Plating |
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| Ma Yalin,Wang Yunyan,Qin Yihong. Technology Situation and Development Prospects of Imitation Gold Plating[J]. Plating & Finishing, 1999, 21(3): 16-19 |
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| Authors: | Ma Yalin Wang Yunyan Qin Yihong |
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| Abstract: | In this paper, the technology situation of high, medium, low, micro, and noncyanide imitation gold plating and posttreating technology the coating were comprehensively reviewed. The development prospects of imitation gold plating was also looked forward to. |
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| Keywords: | imitation gold plating passivation development prospects |
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