| 一种高功率白光LED灯具的封装热设计研究 |
| |
| 引用本文： | 张成敬,王春青.一种高功率白光LED灯具的封装热设计研究[J].电子工艺技术,2007,28(5):257-260,267. |
| |
| 作者姓名： | 张成敬 王春青 |
| |
| 作者单位： | 哈尔滨工业大学材料科学与工程学院,微连接研究室,黑龙江,哈尔滨,150001 |
| |
| 摘 要： | 建立了一种大功率白光LED照明灯具的封装结构,采用ANSYS有限元软件对其进行热分析,根据热分析的结果逐步改进封装结构,在考虑成本和尺寸限制的条件下,对LED的封装散热结构进行了优化.
|
| 关 键 词： | 高功率LED 结构优化 |
| 文章编号： | 1001-3474（2007）05-0257-05 |
| 修稿时间： | 2007-06-04 |
Thermal Analysis and Design of High-power White LED Package |
| |
| ZHANG Cheng-jing,WANG Chun-qing.Thermal Analysis and Design of High-power White LED Package[J].Electronics Process Technology,2007,28(5):257-260,267. |
| |
| Authors: | ZHANG Cheng-jing WANG Chun-qing |
| |
| Affiliation: | Microjoining Laboratory, School of Materials Science and Engineering, Harbin Institute of Technology,Harbin 150001 ,China |
| |
| Abstract: | A novel package and thermal analysis based on ANSYS software for high - power white LED were presented. Package structures were optimized step by step based on the result of thermal analysis. Considering cost and dimensional limitation, the thermal structural optimization of LED was achieved. |
| |
| Keywords: | ANSYS |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
