The anomalous microstructural,tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder |
| |
Authors: | Qiang Xiao Luu Nguyen William D. Armstrong |
| |
Affiliation: | (1) Department of Mechanical Engineering, University of Wyoming, 82071 Laramie, WY;(2) National Semiconductor Corporation, 95052 Santa Clara, CA |
| |
Abstract: | In this study, bulk and thin-cast samples were produced with an identical Sn3.9Ag0.6Cu composition. The thin-cast material exhibited a much finer as-quenched microstructure than the bulk material with the intermetallic compound (IMC) phase restricted to a thin network. Both the bulk and thincast materials continually softened during room-temperature aging, while both materials initially softened and then subsequently hardened when aged at 120°C and 180°C. The thin-cast material was in all cases significantly softer than the bulk material, and responded to aging as if it were bulk material aged at a higher temperature. These results have significant implications for the elevated temperature application of Sn3.9Ag0.6Cu. |
| |
Keywords: | Sn-Ag-Cu lead-free solder aging response microstructural changes tensile properties |
本文献已被 SpringerLink 等数据库收录! |
|