Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors |
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| Authors: | Hung Van Trinh Jan B. Talbot |
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| Affiliation: | Materials Science Program, University of California—San Diego, La Jolla, California 92093 |
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| Abstract: | A method using a combination of electroless and electrolytic plating was developed to provide an alternative method for forming the end terminals of multilayer ceramic capacitors. Electrodeposited terminals were formed by using electroless copper followed by electrolytic nickel plating. The electrical characteristics of the electrodeposited terminal capacitors were compared with standard capacitors and found to be identical. |
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| Keywords: | electrochemistry layered ceramics |
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