首页 | 本学科首页   官方微博 | 高级检索  
     


Effect of thermal residual stresses on fatigue crack opening and propagation behavior in an Al/SiC p metal matrix composite
Authors:M. E. Fitzpatrick  M. T. Hutchings  J. E. King  D. M. Knowles  P. J. Withers
Affiliation:(1) The Open University, MK7 6AA Milton Keynes, UK;(2) National NDT Centre, AEA Technology, OXII ORA Harwell, Didcot, UK;(3) Rolls-Royce pic Aerospace Group, DE24 8BJ Derby, UK;(4) Department of Materials Science and Metallurgy, University of Cambridge, CB2 3QZ Cambridge, UK
Abstract:The effects of a thermal residual stress field on fatigue crack growth in a silicon carbide particle-reinforced aluminum alloy have been measured. Stress fields were introduced into plates of material by means of a quench from a solution heat-treatment temperature. Measurements using neutron diffraction have shown that this introduces an approximately parabolic stress field into the plates, varying from compressive at the surfaces to tensile in the center. Long fatigue cracks were grown in specimens cut from as-quenched plates and in specimens which were given a stress-relieving overaging heat treatment prior to testing. Crack closure levels for these cracks were determined as a function of the position of the crack tip in the residual stress field, and these are shown to differ between as-quenched and stress-relieved samples. By monitoring the compliance of the specimens during fatigue cycling, the degree to which the residual stresses close the crack has been evaluated. formerly Research Student, Department of Materials Science and Metallurgy, University of Cambridge formerly Lecturer, Department of Materials Science and Metallurgy, University of Cambridge This article is based on a presentation made in the symposium entitled “Creep and Fatigue in Metal Matrix Composites” at the 1994 TMS/ASM Spring meeting, held February 28–March 3, 1994, in San Francisco, California, under the auspices of the Joint TMS-SMD/ASM-MSD Composite Materials Committee.
Keywords:
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号