Synthesis and characterization of diamide–diimide–diamines based on p‐amino benzoic acid and their curing and thermal behavior with epoxy blends containing phosphorus/silicon in the main chain

Diimide–diacid ( I ) having an imide group in its rigid structure was synthesized by the refluxing of 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride [4,4′‐carbonyldiphthalic anhydride (BTDA)] and p‐amino benzoic acid in a mixture of acetic acid and pyridine (3 : 2 v/v). The chloroderivative of the diacid ( I ) was synthesized by its reaction with thionyl chloride, this was followed by condensation with different diamines with phenyl, naphthyl, ether, sulfide, and cardo groups to generate a series of diamide–diimide–diamines (DADIDAs). The resultant DADIDAs were characterized by elemental analysis and spectroscopic techniques, namely, Fourier transform infrared spectroscopy and NMR spectroscopy, and were used as epoxy curing agents to impart flame retardancy to the epoxy system. Two epoxy blends (designated as ES and EP) were prepared by the homogeneous mixing of diglycidyl ether of bisphenol A (DGEBA) with 1,3‐bis(3‐glycidyloxypropyl)tetramethyl disiloxane and DGEBA with tris(glycidyloxy)phosphine oxide: each in a ratio of 3 : 2 respectively. The synergistic effect of phosphorus/silicon with nitrogen on the thermal properties of the modified epoxy system was studied. The curing behavior of the epoxy resins formulated by the reaction of stoichiometric amounts of ES/EP with the synthesized DADIDAs were determined by differential scanning calorimetry, and the thermal stabilities of the cured epoxies were evaluated by thermogravimetric analyses (TGAs) under nitrogen and air. TGA indicated that the residual weight percentage of polymers at 800°C was in the range 36.4–60.0 in nitrogen, and in air, it was up to 6.5. However, the major loss in weight in air occurred at elevated temperature; this demonstrated their potential use as flame‐retardant epoxy systems for electronic/electrical encapsulants. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012