Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder |
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Authors: | E ?ad?rl? M ?ahin |
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Affiliation: | (1) Faculty of Arts and Sciences, Department of Physics, Niğde University, 51240 Niğde, Turkey |
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Abstract: | The Sn–3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) at different temperature gradients (G = 1.43–4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3–500 μm/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, λ
L
and transverse section, λ
T
) and mechanical properties (microhardness, HV and ultimate tensile strength, σ
UTS
) of Sn–3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature
gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate
tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing. |
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Keywords: | |
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