Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra |
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| Authors: | Jian Yang Tong Zhang Yue Yin Wenhong Jiang Yunzhe Du Xiaofei Zhu Bo Jiang Yudong Huang |
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| Affiliation: | 1. MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, China;2. Shanghai Aerospace Chemical Engineering Institute, Huzhou, China |
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| Abstract: | Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near-infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and CC double bond value, with determination coefficient (R2) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and CC double bond value in the photothermal curing process, it proved that the silicone resin cured under UV-radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin. |
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| Keywords: | cross-linking resins spectroscopy |
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