首页 | 本学科首页   官方微博 | 高级检索  
     


Three-dimensional micro-pipelines high thermal conductive C/SiC composites
Affiliation:1. Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi''an, Shaanxi, 710072, China;2. School of Aeronautics, Northwestern Polytechnical University, Xi''an, Shaanxi, 710072, China;3. National Innovation Institute of Defense Technology, Academy of Military Sciences PLA China, Beijing, 100071, China;4. National University of Defense Technology, Science and Technology on Scramjet Laboratory, College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, Hunan, 410073, China
Abstract:Carbon/silicon carbide (C/SiC) composites are usually regarded as thermal protective system materials and widely applied in hypersonic vehicles or ramjet. However, poor thermal conductivity of C/SiC composites, leading to severe heat concentration and thermal stress during the high-speed operation of hypersonic vehicle, limits their broad-range of practical applications. Modification with high thermal conductive fillers is an optional method; however, controllable dispersion and orientation of the fillers to construct continuous and ordered heat conductive channel has been proven to be a challenging task. Herein, based on high thermal conductivity fibers, a three-dimensional micro-pipeline preform was developed for the preparation of structure–function integrated C/SiC composites. The technical feasibility of the method, the characteristics of microstructures, and the thermal conductivity and bending strength of the as-obtained composites were systematically studied. Results revealed that the thermal conductivities of as-obtained composites reached 150.2 and 46.7 W m?1 K?1 for in-plane and out-of-plane direction, respectively. The bending strength obtained herein is 264.4 MPa, which is lower than that of polyacrylonitrile C/SiC composites. However, the fine control over the component and microstructure or densification could provide a higher value in the future research. In sum, the proposed method provides a convenient and feasible approach to prepare high thermal conductive C/SiC composites.
Keywords:
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号