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Pt/Si快速热退火固相反应制备超薄PtSi薄膜
引用本文:亓文杰,李炳宗,顾志光,黄维宁,董健民,冯志华,刘毓成.Pt/Si快速热退火固相反应制备超薄PtSi薄膜[J].固体电子学研究与进展,1995(1).
作者姓名:亓文杰  李炳宗  顾志光  黄维宁  董健民  冯志华  刘毓成
作者单位:复旦大学电子工程系,中科院上海技术物理研究所
摘    要:对Pt/Si快速热退火固相反应形成超薄PtSi薄膜进行研究。溅射Pt薄膜的厚度在5~20nm之间,用AES,XRD,RBS,SEM等分析测试手段对固相反应Ptsi薄膜的结构特性进行观测,并对PtSi/n-Si肖特基结电学性能进行了测试。实验结果表明,550~600℃快速返火有利于Pt/Si反应形成性能优良的PtSi/Si肖特基势垒接触。

关 键 词:快速退火,固相反应,PtSi薄膜

PtSi Ultra Thin Film Formation by Solid State Reaction During Rapid Thermal Annealing
Qi Wenjie, Li Bingzong, Gu Zhiguang, Huang Weining.PtSi Ultra Thin Film Formation by Solid State Reaction During Rapid Thermal Annealing[J].Research & Progress of Solid State Electronics,1995(1).
Authors:Qi Wenjie  Li Bingzong  Gu Zhiguang  Huang Weining
Abstract:The PtSi ultra thin film formation by solid state reaction duringrapid thermal annealing has been studied. The sputtered Pt film thickness was inthe range of 5-20 urn, the formed film was characterized by AES, XRD, RBS andSEM. The results indicate that the PtSi film formation depends on the rapid thermal annealing process and a 550-600℃rapid thermal annealing is beneficial for theformation of ultra thin PtSi on n-St with good Schottky barrier contact characteristics.
Keywords:Rapid Thermal Annealing  Solid State Reaction  PtSi Film  
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