通孔电镀铜填孔浅析

电子产品朝更轻、更薄、更快方向发展的趋势,使印制电路板在高密度互连技术上面面临挑战。微堆叠孔技术是一种用来产生高密度互连的方法。通孔的填充介质目前主要有三种,分别为导电膏、树脂、纯铜。比较此三种填充方式,纯铜填孔技术工艺流程短,可靠性高。该文介绍了通孔填孔的反应机理,并论述了通孔填孔电镀技术的优势。

Analysis of the through-hole filling process by copper electroplating

The electronic products toward the trend of lighter,thinner,faster,so the printed circuit boards have challenges in the high density interconnect technology.Stacking the micro-hole technology is a kind of method for making high-density interconnect.Now,there are main three kinds of plugging process in through-hole,they are plugging conductive paste,resin and filling copper in through hole.Compare these three filling patterns,filling the through-hole technology by copper electroplating can reduce the number of overall process and have higher reliability.This thesis introduces the mechanism in copper through-hole filling,and it also discusses the advantages of copper electroplating through-hole filling.