| 印制电路板设计与工艺对信号完整性的影响 |
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| 引用本文： | 朱兴华,陈苑明,何为.印制电路板设计与工艺对信号完整性的影响[J].印制电路信息,2012(1):21-23,52. |
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| 作者姓名： | 朱兴华 陈苑明 何为 |
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| 作者单位： | 1. 珠海方正印刷电路板发展有限公司,广东珠海,519175
2. 电子科技大学应用化学系,四川成都,610054 |
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| 摘 要： | 信号完整性问题是高速数字系统的研究重点,其主要形式有反射、串扰与电磁干扰等。影响信号完整性的物理互连层包括集成电路、芯片封装、印制电路板和系统级连接四个部分,芯片和印制电路板是当前信号完整性研究的主要对象。本文主要阐述了印制电路板设计和工艺对信号完整性的影响。
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| 关 键 词： | 信号完整性 印制电路板 传输线 过孔 制作工艺 |
Signal integrity effect induced by designing and manufacturing of PCB |
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| ZHU Xing-hua CHEN Yuan-ming HE Wei.Signal integrity effect induced by designing and manufacturing of PCB[J].Printed Circuit Information,2012(1):21-23,52. |
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| Authors: | ZHU Xing-hua CHEN Yuan-ming HE Wei |
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| Affiliation: | ZHU Xing-hua CHEN Yuan-ming HE Wei |
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| Abstract: | Signal integrity problem is considered as one key researching direction of high speed digital system in the way of reflection,crosstalk or electro magnetic interference.Signal integrity problem can be directly produced by integrated circuit（IC）,chip packaging,printed circuit board（PCB） and system-level interconnection,while IC and PCB are attracted for studying signal integrity problem.The designing and manufacturing of PCB to introduce signal integrity problem were summarizes. |
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| Keywords: | Signal integrity PCB Transmission line Vias Manufacturing Processes |
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