| 无铅的锡-银-铜焊料的发展——第二代低银含量SnAgCu体系 |
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| 引用本文： | 林金堵,吴梅珠.无铅的锡-银-铜焊料的发展——第二代低银含量SnAgCu体系[J].印制电路信息,2012(1):67-70. |
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| 作者姓名： | 林金堵 吴梅珠 |
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| 作者单位： | 无锡江南计算技术研究所,江苏无锡,214083 |
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| 摘 要： | 概要地评述了无铅焊料中低银含量的锡-银-铜（SnAgCu）体系的发展方向。由于高银含量的锡-银-铜（SnAgCu）体系存在着成本高和耐跌落（摔）性差的问题,它将被低银含量的锡-银-铜（SnAgCu）体系所取代。在低银含量的锡-银-铜（SnAgCu）体系中加入某些微量添加剂可以达到锡-铅焊料的性能水平。
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| 关 键 词： | 无铅焊料 锡-银-铜体系 金属间互化物 性能和成本 微量添加剂 |
The development of the lead-free solder in Sn-Ag-Cu system |
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| LIN Jin-du WU Mei-zhu.The development of the lead-free solder in Sn-Ag-Cu system[J].Printed Circuit Information,2012(1):67-70. |
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| Authors: | LIN Jin-du WU Mei-zhu |
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| Affiliation: | LIN Jin-du WU Mei-zhu |
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| Abstract: | The paper describes that the development direction of low-Ag content Sn-Ag-Cu system in lead-free solder.In the high-Ag content Sn-Ag-Cu system,it has the problem of high-cost and anti-dropping property,the solution is to replace it by low-Ag content Sn-Ag-Cu system.The micro-additive in low-Ag content Sn-Ag-Cu system may arrive on the property-level of Sn-Pb system. |
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| Keywords: | lead-free solder Sn-Ag-Cu system IMC property micro-additive |
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