Establishment of a cutting force model and study of the stress–strain distribution in nano-scale copper material orthogonal cutting

This article focuses on the establishment of a cutting force calculation model in terms of nano-scale orthogonal cutting, and investigates the stress–strain distribution of single-crystal copper that occurs in terms of nano cutting. The cutting force that occurs during the nano-scale cutting of single-crystal copper, and also its changes under different situations, can be found in this study. The molecular dynamics (MD) model was proposed to evaluate the displacement components of the atom in any temporary situation on the nano-scale cutting. The atom and lattice were regarded as the node and element, respectively. The shape function concept of the finite element method (FEM) is used to calculate the equivalent strain of the nodal atom and element. The equivalent stress–strain relationship equation was acquired by nano-scale thin-film tensile simulation in this study, and was used to further calculate the equivalent stress that occurs under the equivalent strain. Subsequently, a stress–strain distribution during nano-scale orthogonal cutting can be acquired.