| 室温固化低黏度双酚F环氧树脂体系的研究 |
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| 引用本文： | 刁岩,洪晓斌,陈一民.室温固化低黏度双酚F环氧树脂体系的研究[J].热固性树脂,2007,22(1):13-15. |
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| 作者姓名： | 刁岩 洪晓斌 陈一民 |
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| 作者单位： | 国防科学技术大学航天与材料工程学院,湖南,长沙,410073 |
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| 摘 要： | 选择具有设计结构的固化剂和活性稀释剂,并研究其对体系性能的影响,确定了室温固化耐高温低黏度双酚F环氧树脂配方体系。该体系黏度低,凝胶时间较长,耐热性良好,力学性能优异。固化产物的T_g可达110℃以上,拉伸强度可达90 MPa,弯曲强度可达150 MPa。能够很好地适用于低温固化,中、高温使用的树脂基复合材料成型技术。
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| 关 键 词： | 室温固化 双酚F环氧树脂 活性稀释剂 改性芳香胺固化剂 |
| 文章编号： | 1002-7432（2007）01-0013-03 |
| 收稿时间： | 2006-07-18 |
| 修稿时间： | 2006-08-02 |
Study on room temperature cured and low viscosity diglycidyl ether of bisphenol F resin system |
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| DIAO Yan,HONG Xiao-bin,CHEN Yi-min.Study on room temperature cured and low viscosity diglycidyl ether of bisphenol F resin system[J].Thermosetting Resin,2007,22(1):13-15. |
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| Authors: | DIAO Yan HONG Xiao-bin CHEN Yi-min |
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| Affiliation: | College of Aerospace and Material Engineering, National University of Defense Technology, Changsha 410073, China |
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| Abstract: | By selecting and optimizing the active diluents,the curing agent and the cure schedule,diglycidyl ether of bisphenol F(DGEBF)resin system cured at room temperature was studied.This system had low vis- cosity,long gel time,high heat-resistance and mechanical properties.When it was cured at 40～50℃,the T_g of castings could reach 110℃and the tensile and flexural strength were 90 MPa and 140 MPa respectively. |
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| Keywords: | room temperature cured diglycidyl ether of bisphenol F epoxy resin active diluents curing agent |
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