反应溅射气体对Ni、Ti薄膜成膜特性的作用机制

反应溅射是降低薄膜表面和界面粗糙度的有效手段。为了研究反应溅射过程中氮气(N2)含量对所制备的Ni、Ti单层膜成膜特性的作用机制,利用掺氮气的反应直流磁控溅射方法制备了Ni和Ti的单层膜样品。首先,采用X射线光电子能谱(XPS)方法测量了Ni和Ti单层膜样品的组分。其次,基于样品的组分测量结果,结合X射线掠入射反射(XRR)方法对样品的厚度和表面粗糙度进行了测量与分析。实验结果表明,随着反应溅射中氮含量的增大,Ti膜的沉积速率呈现快速降低后迅速趋于缓慢变化的趋势,而Ni膜的沉积速率几乎没有变化,Ni膜和Ti膜的表面粗糙度都呈现先减小再增大的趋势,且在氮的含量为8%的条件下,表面粗糙度达到最小值。

The effects of sputtering gas in the characterization of Ni and Ti monolayer films

Reactive sputtering is an effective tool to fabricate thin films or multilayers with smooth surfaces and interfaces.In order to study the effect of nitrogen content in the roughness of Ni and Ti thin films,the Ni and Ti monolayer films were fabricated by reactive sputtering technique with different nitrogen concentration in the sputtering gas atmosphere.Firstly,the X-ray photoelectron spectroscopy (XPS) was used to measure the contamination of Ni and Ti monolayer films.Secondly,the X-ray grazing incidence reflection (XRR) was used to measure the thickness and surface roughness of the films based on their contaminations.The measurement results show that as the nitrogen concentration increased,the growing rate for Ti monolayer decreased tempestuously and tended toward constant,but kept at a constant for Ni monolayers.The roughness on surface of not only Ni but also Ti monolayer decreased firstly and then increased as the nitrogen concentration more than 8%.