| CY-22室温固化耐热环氧胶粘剂的研制 |
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| 引用本文： | 王家勇,李中怡,钟克煌. CY-22室温固化耐热环氧胶粘剂的研制[J]. 中国胶粘剂, 1993, 0(4) |
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| 作者姓名： | 王家勇 李中怡 钟克煌 |
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| 作者单位： | 襄樊市胶粘技术研究所，襄樊市胶粘技术研究所，襄樊市胶粘技术研究所 |
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| 摘 要： | 以双酚 A 环氧树脂、改性固化剂及耐热填料为主要成份配制的胶粘剂可室温固化、高温使用。经一定工艺处理后,其 Tg 达156℃。采用 DSC、TMA 等方法对 CY-22室温固化耐热环氧胶粘剂的配方、工艺及性能进行了研究,并与国内外同类产品进行了比较。
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| 关 键 词： | 室温固化 耐热胶 结构胶 环氧胶 差示扫描量热法 热机械分析 |
Study on CY-22 Room Temperature Curing Heat Resistant Epoxy Adhesive |
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| Wang Jiayong Li Zhongyi Zhong Kehuang. Study on CY-22 Room Temperature Curing Heat Resistant Epoxy Adhesive[J]. China Adhesives, 1993, 0(4) |
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| Authors: | Wang Jiayong Li Zhongyi Zhong Kehuang |
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| Affiliation: | Xiangfan Institute of Adhesive Bonding Technology |
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| Abstract: | CY-22 adhesive,with biphonol A epoxy resin,modified curing agent and heat-resistant filler as main compositions,can be cured at room tempcrature and used at high temperature.Affer treatment,its Tg can be up to 156℃.The paper studies its formula,process and properties,and compares with those produced abroad. |
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| Keywords: | Room temperature euring heat-resistant adhesive structural adhesive epoxy adhesive DSC thermal meehanieal analysis. |
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