| 次磷酸钠化学镀铜工艺的研究 |
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| 引用本文： | 朱绒霞.次磷酸钠化学镀铜工艺的研究[J].应用化工,2011,40(3):457-458,461. |
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| 作者姓名： | 朱绒霞 |
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| 作者单位： | 空军工程大学,理学院,陕西,西安,710051 |
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| 摘 要： | 用次磷酸钠取代传统化学镀铜中的甲醛作为还原剂,研究了化学镀铜的基本工艺,揭示了络合剂(酒石酸钾钠)用量、次磷酸钠用量对铜沉积速度的影响。确定了最佳工艺条件为酒石酸钾钠质量浓度15 g/L,次磷酸钠质量浓度30 g/L,镀液的pH值为11左右,温度65℃。
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| 关 键 词： | ABS塑料 化学镀铜 次磷酸钠 |
Study of the electroless copper plating processes using sodium hypophosphite |
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| ZHU Rong-xia.Study of the electroless copper plating processes using sodium hypophosphite[J].Applied chemical industry,2011,40(3):457-458,461. |
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| Authors: | ZHU Rong-xia |
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| Affiliation: | ZHU Rong-xia(College of Science,Air Force Engineering University,Xi'an 710051,China) |
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| Abstract: | Sodium hypophosphite is used as the reductant of the electroless copper deposition instead of traditional reductant-formaldehyde and the electroless copper plating processes is studied.It revealed the influence of the dosage of chelator(potassium-sodium tartrate) and sodium hypophosphite on the rate of copper deposition.The best technology condition is that the concentration of potassium-sodium tartrate is 15 g/L,sodium hypophosphite is 30 g/L,and the pH is 11,the temperature is 65 ℃. |
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| Keywords: | ABS plastic electroless copper plating sodium hypophosphite |
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