树枝状介孔氧化硅磨粒的制备和抛光性能

使用油水双相分层反应体系(以萘烷为上层油相)制备了具有Y型孔道的树枝状介孔氧化硅颗粒(DMSPs)。透射电镜、扫描电镜、X射线衍射、氮气吸附/脱附和粒度分布的测试结果表明:所得DMSPs样品的粒径为72±6 nm,在液相环境中粒度的分布较窄;其内部的三维中心辐射状介孔孔径为6~8 nm,但是孔道结构没有长程有序性。氧化硅片经DMSPs磨粒抛光后表面的粗糙度均方根值由0.76下降至0.21 nm,最大轮廓波峰高度由1.48下降至0.50 nm、最大波谷深度则由1.86下降至0.45 nm,材料去除率高达187 nm/min。讨论了DMSPs磨粒在界面摩擦磨损和接触粘附过程中的作用机制。

Preparation and Polishing Performance of Dendritic Mesoporous Silica Particle Abrasives

The dendritic mesoporous silica particles (DMSPs) with Y-type mesochannels were synthesized via an oil-water biphase stratification reaction with decahydronaphthalene as the upper oil phase. The spherical DMSPs were then characterized by means of TEM, SEM, Low-angle XRD, nitrigen adsorption/desorption and particle size distribution. Results show that the prepared particles presented an average particle size of 72±6 nm with a narrow size distribution; The DMSPs presented three-dimensional central-radial mesochannels with an average pore inner diameter of 7.7 nm; The formed mesopores presented the lack of long-range order. After polishing with DMSPs abrasives, the root-mean-square roughness of oxidized silicon workpieces reduced from 0.76 to 0.21 nm. The maximum asperity height in sectional profiles decreased from 1.48 to 0.50 nm, and the maximum valley depth reduced from 1.86 to 0.45 nm. An average removal rate of 187 nm/min was achieved. Furthermore, the interfacial friction and wear behavior and contact adhesion effect of DMSPs abrasives were also discussed.