Polypyrrole-based conducting hot melt adhesives for EMI shielding applications |
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| Affiliation: | 1. Indian Institute of Technology Indore, Simrol, Indore 453552, India;2. Shri Govindram Seksaria Institute of Technology and Science, Indore 452001, India;1. National Engineering Research Center of Flame Retardant Materials, National Laboratory of Flame Retardant Materials, School of Materials Science and Engineering, Beijing Institute of Technology, Zhongguancun South Street 5, Haidian District, Beijing 100081, PR China;2. Department of Chemistry and Fire Retardant Research Facility, Marquette University, PO Box 1881, Milwaukee, WI 53201-1881, USA;1. Advanced Carbon Products, Advanced Materials and Devices Division, CSIR-National Physical Laboratory, Dr. K.S. Krishnan Road, New Delhi, 110012, India;2. CSIR-Advanced Materials and Processes Research Institute, Bhopal, 462026, India;3. Academy of Scientific and Innovative Research (AcSIR), India;1. Polymer Science and Engineering, University of Massachusetts, Amherst, MA, USA;2. Henkel Corporation, 10 Finderne Avenue, Bridgewater, NJ 08807, USA |
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| Abstract: | Intrinsically conducting hot melt adhesives (ICHMAs) have been developed, based on polypyrrole (PPy) blends, for use in electronic and telecommunication applications requiring shielding against electromagnetic interference (EMI). These advanced materials have been formulated to exhibit significant EMI shielding effectiveness (SE) while retaining the superior properties of conventional hot melt adhesives. The conductivity properties, adhesion characteristics and both near- and far-field EMI SE behaviour of these ICHMAs at room temperature are investigated as a function of PPy content. The environmental stability of the conductivity is also reported. Potential use of such new materials in current and future electronic applications is anticipated. |
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