Cu-Cr粉体致密化及颗粒流变三维数值模拟分析

利用MSC.Marc有限元软件对Cu-Cr粉体致密化及颗粒流变行为进行了三维数值模拟。分析了不同颗粒排列方式压制载荷下Cu-Cr颗粒致密化、颗粒与节点的流动规律。首次再现了Cu-Cr颗粒在致密化过程中的三维流变行为。结果表明,六角形排列的Cu-Cr颗粒不仅流动性高,而且均匀性也好于方形排列的Cu-Cr颗粒。温粉冷模比温粉温模(恒温环境)在100℃条件下的致密度高0.36%,在800℃条件下高2.87%。六角形排列的Cu-Cr颗粒致密度在摩擦系数为0.1时最高为95.6859%,方形排列的Cu-Cr颗粒致密度在摩擦系数为0.5时最高为97.5343%。无摩擦理想状态下的Cu-Cr颗粒致密化并没有达到最大致密度。

Three-Dimensional Numerical Simulation of Densification and Particle Rheology of Cu-Cr Powders

The MSC.Marc finite element software was used to three-dimensional finite element simulation the densification and rheological behavior of copper/chromium powders.The densification of different Cu-Cr particle arrangement modes under compression loading and the flow pattern of particles and nodes were analyzed.The three-dimensional rheological behavior of Cu-Cr particles in densification is demonstrated for the first time.The results show that the Cu-Cr particles of the staggered arrangement not only have high fluidity,but also have better uniformity than the Cu-Cr particles of the square arrangement.The density of warm powder in cold mold is 0.36%higher than that of warm powder Thawing mold(isoperibol environment)at 100℃,and 2.87%higher at 800℃.The maximum density of Cu-Cr particles of the staggered arrangement is 95.6860%when the friction coefficient is 0.1.The maximum density of Cu-Cr particles of the square arrangement is 97.5343%when the friction coefficient is 0.5.The densification of Cu-Cr particles in the ideal condition without friction does not achieve the maximum density.