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利用分步试验设计表征/优化工艺空间均匀性
引用本文:游海龙,贾新章,徐岚,陈亚兰. 利用分步试验设计表征/优化工艺空间均匀性[J]. 微电子学, 2009, 39(2)
作者姓名:游海龙  贾新章  徐岚  陈亚兰
作者单位:1. 西安电子科技大学,微电子学院,西安,710071;宽禁带半导体材料与器件教育部重点实验室,西安,710071
2. 中国电子科技集团公司,第二十四研究所,重庆,400060
基金项目:模拟集成电路国家级重点实验室基金 
摘    要:半导体制造工艺成品率对空间差异越来越敏感,需要表征与优化工艺空间均匀性.利用两步试验设计方法,针对六输入变量的热氧化工艺,仅需31次试验,便建立了表征工艺目标和空间均匀性响应曲面模型.利用该模型优化工艺,得到了满足其他工艺指标下工艺空间均匀性最优的工艺设置.片间非均匀性从1.44%减小到0.77%,片内非均匀性从0.2%减小到0.12%.

关 键 词:半导体工艺  工艺空间均匀性  分步试验设计  响应曲面模型

Characterization and Optimization of Process Spatial Uniformity Using Sequential Experimental Design
YOU Hailong,JIA Xinzhang,XU Lan,CHEN Yalan. Characterization and Optimization of Process Spatial Uniformity Using Sequential Experimental Design[J]. Microelectronics, 2009, 39(2)
Authors:YOU Hailong  JIA Xinzhang  XU Lan  CHEN Yalan
Affiliation:1.School of Microelectronics;Xidian Univ.;Xi'an 710071;P.R.China;2.Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices;3.Sichuan Institute of Solid-State Circuits;China Electronics Technology Group Corp.;Chongqing 400060;P.R.China
Abstract:Semiconductor manufacturing process yield becomes more and more sensitive to spatial difference,so characterizing and optimizing the process spatial uniformity is needed.With two-step experimental design method,only 31 experiments were designed for thermal oxidization process of six input factors.Response surface models of film thickness and process spatial uniformity were constructed through experiment.The optimum process sets of uniformity that meet other process goals were obtained using the model.The wa...
Keywords:Semiconductor process  Process spatial uniformity  Sequential experimental design  Response surface model  
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