| 化学镀镍、模版印刷法制备倒扣芯片焊料凸点 |
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| 引用本文： | 孟宣华,林晶,宗祥福. 化学镀镍、模版印刷法制备倒扣芯片焊料凸点[J]. 半导体技术, 2002, 27(3): 31-36. DOI: 10.3969/j.issn.1003-353X.2002.03.012 |
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| 作者姓名： | 孟宣华 林晶 宗祥福 |
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| 作者单位： | 复旦大学材料科学系,上海,200433 |
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| 摘 要： | 回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展.
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| 关 键 词： | 化学镀镍 模版印刷 焊料凸点 倒扣芯片 晶圆凸点 |
| 文章编号： | 1003-353X(2002)03-0031-06 |
Wafer bumping by electroless nickel and stencil printing |
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| MENG Xuan-hua,LIN Jing,ZONG Xiang-fu. Wafer bumping by electroless nickel and stencil printing[J]. Semiconductor Technology, 2002, 27(3): 31-36. DOI: 10.3969/j.issn.1003-353X.2002.03.012 |
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| Authors: | MENG Xuan-hua LIN Jing ZONG Xiang-fu |
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| Abstract: | In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps. The development and recent research are also reviewed . |
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| Keywords: | electroless nickel stencil print solder bump flip chip wafer bumping |
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