| SnAgCuEr系稀土无铅钎料的显微组织 |
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| 引用本文： | 田君,郝虎,史耀武,夏志东.SnAgCuEr系稀土无铅钎料的显微组织[J].焊接学报,2006,27(9):31-34. |
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| 作者姓名： | 田君 郝虎 史耀武 夏志东 |
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| 作者单位： | 1. 北京工业大学,材料科学与工程学院,北京,100022;福建工程学院,机电及自动化工程系,福州,350014
2. 北京工业大学,材料科学与工程学院,北京,100022 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 系统研究了添加微量稀土Er对Sn3.8Ag0.7Cu无铅钎料合金显微组织和性能的影响.试验发现,微量Er的添加,使Sn3.8Ag0.7Cu钎料合金的熔化温度稍有降低,铺展面积有所增加,抗剪强度有所提高.通过显微组织观察,加Er后网状共晶物体积百分比增大,初晶金属间化合物(IMC)的尺寸变小.微量Er抑制了时效过程钎料与铜基体界面IMC层(IML)的增厚,时效400 h后差别更明显,有利于提高钎料接头的可靠性.指出含微量稀土的SnAgCuEr合金是性能优良的无铅钎料合金.
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| 关 键 词： | 无铅钎料 SnAgCu合金 稀土Er 显微组织 时效处理 |
| 文章编号： | 0253-360X（2006）09-031-04 |
| 收稿时间： | 08 1 2005 12:00AM |
| 修稿时间： | 2005-08-01 |
Microstructure of lead-free solder for a SnAgCuEr system |
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| TIAN Jun,HAO Hu,SHI Yao-wu and XIA Zhi-dong.Microstructure of lead-free solder for a SnAgCuEr system[J].Transactions of The China Welding Institution,2006,27(9):31-34. |
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| Authors: | TIAN Jun HAO Hu SHI Yao-wu and XIA Zhi-dong |
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| Affiliation: | School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China;Department of Electromechanical and Automatical Engineering, Fujian University of Technology, Fuzhou 350014, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China,School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China and School of Materials Science & Engineering, Beijing University of Technology, Beijing 100022, China |
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| Abstract: | Effect of minim amount rare earth Er on microstructure and performance has been systematically investigated for a Sn3.8Ag0.7Cu lead-free solder alloy.It is found that the addition of minim amount Er in the Sn3.8Ag0.7Cu solder leads to slight decrease in melting temperature,increase in spreading area and shear strength.Through observation of microstructure,the area fraction of eutectics is increased and the size of prime intermetallic compounds(IMC) is decreased due to the effect adding Er.The thickness of IMC layer between solder and substrate Cu is restrained in the aging process,and the restraint is especially evident after aging of 400 h.This will be helpful for the reliability of soldered joint.The results indicates that the SnAgCuEr alloy with minim amount rare earth is lead-free solder alloy with excellent performance. |
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| Keywords: | lead-free solder SnAgCu alloy rare earth Er microstructure aging treatment |
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