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| 可与氟树脂基板相匹敌的热可塑性树脂基板材料 | |
| 引用本文： | 蔡积庆.可与氟树脂基板相匹敌的热可塑性树脂基板材料[J].印制电路信息,2006(6):33-36,47. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了可以与氟树脂基板相匹敌的低介质特性的热可塑性树脂基板材料的开发和应用。 |
| 关 键 词： | 热可塑性树脂基板 聚链烯变性技术 氟树脂基板 低介质特性 |
Thermoplastic Resin Substrate Material Compared with Fluorine Resin Substrate |
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| Cai Jiqing.Thermoplastic Resin Substrate Material Compared with Fluorine Resin Substrate[J].Printed Circuit Information,2006(6):33-36,47. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the development and application of thermoplastic resin substrate material having low dielectric characteristic compared with fluorine resin substrate. |
| Keywords: | thermoplastic resin substrate polyolefine deraturation technology fluorine resin substrate low dielectric characteristic |
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