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微流控芯片金属模具制备工艺研究
引用本文:李建华,陈迪,刘景全,朱军.微流控芯片金属模具制备工艺研究[J].微细加工技术,2005(4):56-58,75.
作者姓名:李建华  陈迪  刘景全  朱军
作者单位:上海交通大学,微纳技术研究院,薄膜与微细技术教育部重点实验室,微米纳米加工技术国家级重点实验室,上海,200030
基金项目:国家863MEMS重大专项资助项目(200211404150);国家863计划资助项目(2004AA404260)
摘    要:为了解决SU-8光刻胶电铸金属模具中遇到的光刻胶脱落和电铸后去胶难等问题,提出了采用硅橡胶(PDMS)微复制与电铸毛细管电泳芯片金属模具相结合的新工艺。该方法首先用SU-8光刻胶制备微通道阳模,以此为模版浇注PDMS阴模,然后在此PDMS阴模上电镀金属模具。与采用SU-8光刻胶电镀金属模具相比,此方法不存在光刻胶与衬底结合力差以及去胶难等问题,所制备的金属模具侧壁垂直,表面光滑。

关 键 词:SU-8  UV—LIGA  PDMS  金属模具  微流控
文章编号:1003-8213(2005)04-0056-03
收稿时间:2005-03-23
修稿时间:2005-03-232005-05-20

Microfluidic Mold Insert Prepared Using a Novel Method
LI Jian-hua,CHEN Di,LIU Jing-quan,ZHU Jun.Microfluidic Mold Insert Prepared Using a Novel Method[J].Microfabrication Technology,2005(4):56-58,75.
Authors:LI Jian-hua  CHEN Di  LIU Jing-quan  ZHU Jun
Affiliation:The State Laboratory of Micro/Nanometer Fabrication Technology, Key Laboratory of Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiao Tong University, Shanghai 200030, China
Abstract:A novel method was proposed using SU-8 as the electroplating mold, prepared by this method shows smooth SU-8 removal. to prepare a microfluidic mold insert. Instead of directly a PDMS replica was employed. The metallic mold insert surface and vertical walls while without the difficulty of
Keywords:SU-8  U V- LIGA  PD M S  mold insert  mierofluidic
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