| 表面活性化常温结合过程中表面微观形貌变化的AFM研究 |
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| 引用本文： | 褚家如,赤津豪.表面活性化常温结合过程中表面微观形貌变化的AFM研究[J].电子显微学报,1995,14(6):434-439. |
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| 作者姓名： | 褚家如 赤津豪 |
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| 作者单位： | 中国科学技术大学精密机械与精密仪器系，日本东京大学先端科学技术研究中心 |
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| 摘 要： | 用表面活化方法实现了Ａｌ和Ｓａｐｐｈｉｒｅ之间常温直接结合，用原子力显微镜研究了电解腐蚀，高速原子束轰击和压接等过程中样品表面微观形貌及微粗糙度的变化，提示了压接前样品表面微观粗糙度对接合强度的影响，为优化表面活性常温结合过程控制，提高了ＳＡＢ接合强度提供了的实验依据。
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| 关 键 词： | 超光滑表面 原子力显微镜 表面活化 常温接合 |
Characterization of the Surfaces in the Processes of Surface Activated Bonding by Atomic Force Microscope |
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| Chu Jiaru Huang Wenhao.Characterization of the Surfaces in the Processes of Surface Activated Bonding by Atomic Force Microscope[J].Journal of Chinese Electron Microscopy Society,1995,14(6):434-439. |
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| Authors: | Chu Jiaru Huang Wenhao |
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| Abstract: | Al and Sapphire were bonded with each other at room temperature by surface activation (SAB)method.The microtopographes on the surfaces polished by electro-chemical method, bombarded by fast atom beam andcompressed with each other in the process of surface activated bonding(SAB ) for the material pair of Al andSapphire were studied respectively. The direct evidence obtained from the AFM characterization about the ef-fects of surface microroughness on the bonding strength were given to optimize the control of SAB process. |
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| Keywords: | ultra-smooth surface AFM surface activated bonding micro-assembly |
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