Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies |
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| Authors: | O Nousiainen L Lehtiniemi T Kangasvieri R Rautioaho J Vhkangas |
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| Affiliation: | aMaterials Engineering Laboratory and EMPART Research Group of Infotech Oulu, University of Oulu, P.O. Box 4500, FIN-90014, Finland;bMicroelectronics and Materials Physics Laboratories and EMPART Research Group of Infotech Oulu, University of Oulu, P.O. Box 4500, FIN-90014, Finland |
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| Abstract: | The behavior of thermomechanically loaded collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies with high (LTCC/FR-4; ΔCTE  10 ppm/°C) and low (LTCC/Arlon; ΔCTE < 10 ppm/°C) global thermal mismatches was studied by exposing the assemblies into two thermal cycling tests. The characteristic lifetimes of the LTCC/FR-4 assemblies, tested over the temperature ranges of 0–100 °C and −40 to 125 °C, were 1475 and 524 cycles, respectively, whereas the corresponding values of the LTCC/Arlon assemblies were 5424 and 1575 cycles. According to the typical requirements for the industrial lifetime duration of solder joints, the former values are inadequate, whereas the latter are at an acceptable level in a few cases. Furthermore, the global thermal mismatch affected the thermal fatigue behavior of the 95.5Sn4Ag0.5Cu spheres in the temperature range of −40 to 125 °C. |
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