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陶瓷二次金属化镀镍工艺研究
引用本文:崔永丽,江利. 陶瓷二次金属化镀镍工艺研究[J]. 表面技术, 2002, 31(4): 29-31. DOI: 10.3969/j.issn.1001-3660.2002.04.009
作者姓名:崔永丽  江利
作者单位:中国矿业大学机电与材料工程学院,江苏,徐州,221008
摘    要:对陶瓷二次金属化镀镍工艺及其工艺中需要注意的问题进行了探讨,并对镀镍层常见缺陷进行了分析.此工艺对生产试验具有一定的作用.

关 键 词:陶瓷与金属连接  镀镍  缺陷  工艺
文章编号:1001-3660(2002)04-0029-03

Study on the Process of Ceramic Second Metalizeation-nickel Electroplating
CUI Yong li,JIANG Li. Study on the Process of Ceramic Second Metalizeation-nickel Electroplating[J]. Surface Technology, 2002, 31(4): 29-31. DOI: 10.3969/j.issn.1001-3660.2002.04.009
Authors:CUI Yong li  JIANG Li
Abstract:In this paper, the typical process of second metalization-nickel electroplating and its main influenle factor are investigated, and the common imperfections appearing in nickel-coated layer are analyzed also. The technology has important action in its research and its application.
Keywords:Ceramic and metal joining  Nickel electroplating  Surface defect  Technology
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