| 铜化学机械抛光中电化学理论的应用研究 |
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| 引用本文： | 李秀娟,金洙吉,苏建修,康仁科,郭东明.铜化学机械抛光中电化学理论的应用研究[J].润滑与密封,2005(1):106-108,121. |
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| 作者姓名： | 李秀娟 金洙吉 苏建修 康仁科 郭东明 |
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| 作者单位： | 大连理工大学精密与特种加工教育部重点实验室,辽宁大连,116024 |
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| 基金项目： | 国家自然科学基金重大项目资助(50390061) |
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| 摘 要： | 概述了电位-pH图、极化曲线、交流阻抗谱和开路电压测试等电化学方法在铜化学机械抛光(Cu—CMP)中的应用，并分析了采用电化学方法进行CMP分析存在的问题，指出采用以上电化学方法进行Cu—CMP分析有利于对Cu—CMP的过程的理解，并可以为抛光液组分的选配提供依据。
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| 关 键 词： | 化学机械抛光 电化学 抛光液 铜 CMP分析 |
| 文章编号： | 0254-0150(2005)1-106-3 |
Applied Study of Electrochemistry Theory on the Copper Chemical-mechanical Polishing |
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| Li Xiujuan,Jin Zhuji,Su Jianxiu,Kang Renke,Guo Dongming.Applied Study of Electrochemistry Theory on the Copper Chemical-mechanical Polishing[J].Lubrication Engineering,2005(1):106-108,121. |
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| Authors: | Li Xiujuan Jin Zhuji Su Jianxiu Kang Renke Guo Dongming |
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| Abstract: | The electrochemical methods such as potential-pH diagram,polarization curves,electrochemical impedance spectroscopy(EIS) and open circuit potential(OCP)applied on the chemical-mechanical polishing of copper(Cu-CMP) were summarized,and the defect of those methods on the Cu-CMP were also analyzed.It is pointed out that it is helpful to realize the process of Cu-CMP,and select the constitute of slurry by adopting the electrochemical methods described above. |
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| Keywords: | chemical mechanical polishing electrochemistry slurry |
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