Effect of grain size on creep of Ti-53.4mol%Al intermetallics at 1100 K |
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Authors: | Hashiru Nagai Tohru Takahashi Hiroshi Oikawa |
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Affiliation: | (1) Department of Materials Science, Faculty of Engineering, Tohoku University, 980 Sendai, Japan;(2) Present address: Semiconductors Group, Toshiba, 210 Kawasaki, Japan |
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Abstract: | Constant stress creep under compression stress, 100 to 316 MPa, at 1100 K was investigated on single-phase TiAl intermetallics. The material was ingot-cast, isothermally forged, and then annealed to produce stable equi-axed grain structures, whose average grain diameters were 25, 42 and 70 m. Creep curves were very similar among the three specimens with different grain diameters and the creep rates at a given strain, as well as the minimum creep rates, depended little on grain size. Two regimes were observed on the stress dependence of the minimum creep rate. The stress exponent under high stresses was about 4.5, independent of grain size. Under stresses lower than about 150 MPa it became about 8. |
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