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GaAs抛光片腐蚀过程初步研究
引用本文:郝建民.GaAs抛光片腐蚀过程初步研究[J].半导体杂志,2000,25(2):17-22.
作者姓名:郝建民
作者单位:天津电子材料研究所!天津,300192
摘    要:采用X射线衍射、X射线双晶衍射和X射线荧光三种手段对经H2SO4:H2O2:H2O=16:1:1和3:1:1腐蚀液,在不腐蚀条件下得到的GaAs片子进行近表层结晶完整性、片子表面的残留产物以及发射二次X射线情况测量,并初步分析了这些数据。

关 键 词:抛光片  腐蚀  砷化镓

Primary Study of Etching Process for Polished GaAs Wafers
Authors:HAO Jian-min
Abstract:The studied wafers were etched by H 2SO 4:H 2O 2:H 2O=16:1:1 or 3:1:1 at proper temperature. The near surface crystal perfection, the residual substance at the surface of the wafers after etching, and the secondary X-ray emission were measured by DCXRD, XRD and XRF respectively. A primary analysis was given.
Keywords:Polished GaAs Wafers  Etch  X-ray  
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