| 各向异性导电胶粘接可靠性研究进展 |
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| 引用本文： | 张军,陈旭.各向异性导电胶粘接可靠性研究进展[J].电子元件与材料,2004,23(1):35-38. |
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| 作者姓名： | 张军 陈旭 |
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| 作者单位： | 天津大学化工学院,天津,300072;天津大学化工学院,天津,300072 |
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| 基金项目： | 国家自然科学基金资助项目(10272080) |
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| 摘 要： | 介绍各向异性导电胶导电机理和粘接工艺,以及影响它的粘接可靠性因素和最佳参数的研究,如粘接温度、固化时间、粘接压力、粒子含量等。对各向异性导电胶粘接可靠性中的开路、短路、接触电阻与粘接压力和温度循环的关系进行了讨论,并介绍了各向异性导电胶可靠性的理论计算模型。
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| 关 键 词： | 各向异性导电胶 导电机理 粘接可靠性 |
| 文章编号： | 1001-2028(2004)01-0035-04 |
Progress in Research on Reliability of Anisotropic Conductive Adhesives |
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| ZHANG Jun,CHEN Xu.Progress in Research on Reliability of Anisotropic Conductive Adhesives[J].Electronic Components & Materials,2004,23(1):35-38. |
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| Authors: | ZHANG Jun CHEN Xu |
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| Abstract: | The electrical conduction mechanisms and bonding process of Anisotropic Conductive Adhesives (ACA) in electronics application are presented. Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction. Open circuit, short circuit, and the relationship of contact resistance with bonding pressure and temperature cycling are discussed in ACA bonding process. |
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| Keywords: | anisotropic conductive adhesives electrical conduction mechanism bonding reliability |
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