| FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au／Ni／Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING |
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| 作者姓名： | Y.H.Tian C.Q.Wang |
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| 作者单位： | StateKeyLaboratoryof-AdvancedWeldingProductionTechnology,HarbinInstituteofTechnology,Harbin150001,China |
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| 摘 要： | Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied.During laser reflow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was reflowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.
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| 关 键 词： | Au／Ni／Cu 钎焊 焊接材料 63Sn37Pb合金 PBGA 焊接接头 激光焊 |
Formation and Change of AuSn4 Compounds at Interface Between PBGA Solder Ball and Au/Ni/Cu Metallization During Laser and Infrared Reflow Soldering |
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| Y.H.Tian C.Q.Wang.Formation and Change of AuSn4 Compounds at Interface Between PBGA Solder Ball and Au/Ni/Cu Metallization During Laser and Infrared Reflow Soldering[J].Acta Metallurgica Sinica(English Letters),2004,17(2):199-204. |
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| Authors: | YHTian CQWang |
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| Affiliation: | State Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 150001,China |
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| Abstract: | Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during
laser and infrared reflow soldering were studied. During laser reflow soldering process,
a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphology
was strongly dependent on the laser reflow power and heating time. The solder bumps
formed by the first laser reflow was reflowed again to form the solder joints. The
AuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solder
after the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-
like, and distributed inside the solder near the solder/pad interface. |
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| Keywords: | laser reflow infrared reflow bump's microstructure solder joint |
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