Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding |
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Authors: | Xiaoping Shui D. D. L. Chung |
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Affiliation: | (1) Composite Materials Research Laboratory, Furnas Hall, State University of New York at Buffalo, 14260-4400 Buffalo, NY |
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Abstract: | Short nickel filaments of diam 0.4 μm and containing 94 vol% Ni and 6 vol% C were fabricated by electroplating with nickel 0.1 μm diam catalytically grown carbon filaments. The use of these filaments in polyether sulfone in amounts of 3, 7,13, and 19 vol% gave composites with electromagnetic interference shielding effectiveness at 1–2 GHz of 42,87,84, and 92 dB, respectively, compared to a value of 90 dB for solid copper. Less shielding was attained when 0.1 μm diam carbon filaments or 2 or 20 μm diam nickel fibers were used instead. |
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Keywords: | Composites electromagnetic interference filaments fibers nickel shielding |
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