树脂温差在解决气泡问题上的运用

本文从树脂成型工艺中树脂预热温度来讨论其对气泡发生的影响，并通过实践研究得出了树脂温差对减少气泡发生的重要影响，它可以借鉴于各集成电路后道封装厂家，定会得到很好的效果。

The Application of Resin's Temperature Deference to the Void Problem

This article just focus on the effect of pre - heat temperature of resin on void during the forming process of resin. By practice, the conclusion arrives that the temperature difference of resin would have a positive effect on void diminution which can be adopted by IC assembly factories and would surely gain something from it.