苯乙烯共聚物改性TATB基PBX的抗热冲击性能

为改善TATB基高聚物粘结炸药(PBX)的抗热冲击性能,采用苯乙烯共聚物对TATB基PBX进行改性。分析了TATB基PBX及其苯乙烯共聚物改性配方的拉伸力学性能及热物理性能,并对改性前后配方的抗热冲击性能进行了比较。采用Agari串联模型对TATB基PBX及其苯乙烯共聚物改性配方的导热行为进行了模拟。结果表明,加入高玻璃化转变温度和高力学强度的苯乙烯共聚物可以明显提高TATB基PBX的拉伸强度和弹性模量,同时降低线膨胀系数和导热系数。理论预测模型和试验数据吻合良好。添加质量分数为1%的苯乙烯共聚物后,常温下TATB基PBX的抗热应力因子由10.72 W·m~(-1)提高到13.16 W·m~(-1)。随着温度升高,TATB基PBX的抗热冲击性能逐渐下降。在玻璃化温度范围转变范围(323~343 K),TATB基PBX的抗热应力因子显著降低。加入苯乙烯共聚物可以抑制323~343 K温度范围内TATB基PBX的抗热应力因子的下降程度。

Thermal Shock Resistance of Styrene Copolymer Modified TATB-based Polymer Bonded Explosive

To improve the thermal shock resistance of TATB-based polymer bonded explosive (PBX), TATB-based PBX was modified by styrene copolymer. The tensile mechanical properties and thermophysical properties of TATB-based PBX and its formulation modified by styrene copolymer were analyzed, and the thermal shock resistances of formulation before and after modification were compared. The thermal conductivity behaviors of TATB-based PBX and its styrene copolymer modified formulation were simulated by Agari series model. Results show that the addition of styrene copolymer with high glass transition temperature and high mechanical strength can improve the tensile strength and elastic modulus of TATB-based PBX and simultaneously reduce the linear expansion coefficient and thermal conductivity of TATB-based PBX. The results predicted by theoretical model are in good agreement with the experimental data. After the addition of styrene copolymer of mass fraction as 1%, the thermal stress resistance factor of TATB-based PBX at normal temperature increases from 10.72 W·m^-1 to 13.16 W·m^-1. With the increase of temperature, the thermal shock resistances of TATB-based PBXs decrease gradually. The thermal stress resistance factor of TATB-based PBX decreases significantly in the temperature range of glass transition from 323 K to 343 K. The addition of styrene copolymer can restrict decreasing extent of the thermal stress resistance factor of TATB-based PBX in the temperature range of 323 K to 343 K.