金属三维微结构加工技术的研究

三维微结构制作技术是MEMS加工的关键技术之一.现有的三维微细加工技术主要有利用SU-8等光刻胶形成的以IC工艺为基础的硅三维微结构制作技术和以同步辐射X射线曝光为基础的LIGA技术.但是,在传统的去胶液中,SU-8光刻胶会膨胀变形,从而可能导致图形的失败.而LIGA技术需要昂贵的同步辐射光源和特制的LIGA掩模板,加工周期长.为此,基于反应离子深刻蚀技术,结合电镀工艺,提出了一种金属微结构的微加工制作方法,并进行了相应的实验.结果表明,该方法不仅可以制造出深宽比为6的微型金属螺旋线圈,还可以为其他非硅三维微结构的加工提供一定的技术支持.

Metal Microstructure Microfabrication Technique

The fabrication technique of three- dimemional microstructure is important in the MEMS microfabrication technology.The main methods of are silicon three - dimensional micmfabrcaiton combining the SU - 8 photoresist and IC process and LIGA - type microfabreation. However, SU - 8 microfabrciann has limitation on the strip off process and the cost of LIGA - type is high. So, a new three - dimensional microfabfication technique for metal materials was developed from the silicon deep etching technique and electroplating technique. In the present research, a silicon mold with high aspect ratio micmstructures was manufactured and metal micro structures were fabricated using this mold. A successful development of this technique opens a alternative way for three dimensional microfabrication techniques.