| 电镀铜锡合金工艺研究进展 |
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| 引用本文： | 钟云,何永福,贺飞,刘利梅,苏永庆.电镀铜锡合金工艺研究进展[J].电镀与环保,2007,27(4):1-3. |
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| 作者姓名： | 钟云 何永福 贺飞 刘利梅 苏永庆 |
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| 作者单位： | 云南师范大学化学化工学院,云南昆明650092 |
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| 摘 要： | 电镀铜锡合金具有装饰性好、可焊性优良、成本低、无毒、不使人体过敏等优点,而得到广泛的应用.介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件.
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| 关 键 词： | 铜锡合金 电镀 进展 |
| 文章编号： | 1000-4742（2007）04-0001-03 |
| 修稿时间： | 2007-01-02 |
Advance in Research of Cu-Sn Alloy Plating Processes |
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| ZHONG Yun,HE Yong-fu,HE Fei,LIU Li-mei,SU Yong-qing.Advance in Research of Cu-Sn Alloy Plating Processes[J].Electroplating & Pollution Control,2007,27(4):1-3. |
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| Authors: | ZHONG Yun HE Yong-fu HE Fei LIU Li-mei SU Yong-qing |
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| Abstract: | Electroplated Cu-Sn alloy coating is good in decoration and solderability, low in cost, non-toxic, not irritable, etc., and has been widely used. The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced. |
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| Keywords: | Cu-Sn alloy electroplating advance |
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