| PBGA器件焊点成形建模与三维形态预测 |
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| 引用本文： | 周德俭,陈子辰.PBGA器件焊点成形建模与三维形态预测[J].浙江大学学报(自然科学版 ),2000,34(6):637-641. |
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| 作者姓名： | 周德俭 陈子辰 |
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| 作者单位： | 浙江大学机械工程学系,浙江杭州 |
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| 基金项目： | 信息产业部电子科学研究院预研基金资助项目! (DJ3.2 .4.2 ) |
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| 摘 要： | 应用最小能量原理和有限元方法，建立塑料球栅阵开（ＰＢＧＡ：Ｐｌａｓｔｉｃ Ｂａｌｌ ＧｒｉｄＡｒｒａｙ）器件焊点三维形态预测模型，对ＰＢＧＡ焊点三维形态时间预测和分析，并将预测结果与试验结果以及国外学者用数学分析模型所得到的预测结果进行了对比验证，具有很好的一致性。
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| 关 键 词： | 球栅阵列 焊点形态 最小能量原理 PBGA器件 SMT |
Modeling and predicting solder joint shapes of Plastic Ball Grid Array |
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| ZHOU De\|jian\ \{,\},CHEN Zi\|chen\ ,PAN Kai\|lin\ \{,\},WU Zhao\|hua\ \.Modeling and predicting solder joint shapes of Plastic Ball Grid Array[J].Journal of Zhejiang University(Engineering Science),2000,34(6):637-641. |
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| Authors: | ZHOU De\|jian\ \{ \} CHEN Zi\|chen\ PAN Kai\|lin\ \{ \} WU Zhao\|hua\ \ |
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| Affiliation: | ZHOU De\|jian\ \{1,2\},CHEN Zi\|chen\ 1,PAN Kai\|lin\ \{1,2\},WU Zhao\|hua\ 2\, |
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| Abstract: | Minimal energy principle and finite element method were employed in modeling the solder joint shapes of Plastic Ball Grid Array(PBGA) device. And three\|dimensional solder joint shapes of PBGA device were predicted and analyzed. Comparisons are made between results predicted by the current model here and experimental measurements and those generated by mathematical analysis model at abroad, which show in good agreements. |
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| Keywords: | ball grid array solder joint shapes minimal energy principle |
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