| 铅板无氰仿金镀工艺研究 |
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| 引用本文： | 徐炳辉,张艳,孙雅茹,张春艳. 铅板无氰仿金镀工艺研究[J]. 电镀与精饰, 2009, 31(9) |
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| 作者姓名： | 徐炳辉 张艳 孙雅茹 张春艳 |
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| 作者单位： | 沈阳工业大学,理学院,辽宁,沈阳,110178 |
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| 摘 要： | 用扫描电镜和能谱分析方法,研究了铅板上仿金镀层组成颜色及表面形貌,确定了铅板上仿金电镀的工艺流程及最佳工艺参数.结果表明,以光亮镀镍打底,仿金镀的Jκ=1.2 A/dm2;pH=8.5～9.3;θ=20～35℃;t=1～4 min的条件下,能够获得仿金色镀层,且镀层表面平整,结晶细致,无裂痕、孔隙,镀层质量较好.
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| 关 键 词： | 铅板 仿金镀 电流密度 |
Study on Cyanide-free Imitation Gold Plating Technology of Lead Plate |
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| XU Bing-hui,ZHANG Yan,SUN Ya-ru,ZHANG Chun-yan. Study on Cyanide-free Imitation Gold Plating Technology of Lead Plate[J]. Plating & Finishing, 2009, 31(9) |
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| Authors: | XU Bing-hui ZHANG Yan SUN Ya-ru ZHANG Chun-yan |
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| Affiliation: | XU Bing-hui,ZHANG Yan,SUN Ya-ru,ZHANG Chun-yan (School of Sciences,Shenyang University of Technology,Shengyang 110178,China) |
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| Abstract: | The application of imitation gold electroplating technology to lead plate was studied.The effects of various factors including the electric current density,bath temperature,plating times and bath pH value on surface color,metal element contents and surface morphology of the coating were investigated using scanning electronic microscope and energy analysis spectrometer.The results show that pretreatment of bright nickel plating is necessary for increasing the surface brightness and hardness of the coating;wh... |
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| Keywords: | pH |
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