单晶硅表面微结构纳秒脉冲激光加工研究

以单晶硅为对象,使用波长355 nm、脉宽15 ns的纳秒激光对单晶硅进行烧蚀加工试验研究.基于单因素法设计并完成了单晶硅纳秒脉冲激光直线刻蚀试验,探究了激光输出功率、激光脉冲重复频率、激光扫描速度和扫描次数对纳秒脉冲激光加工单晶硅表面形貌的影响规律.基于优化的加工工艺参数,在单晶硅表面制备出方形阵列的微结构.

Study of Microstructures on Monocrystalline Silicon Surface by Nanosecond Laser Processing

With monocrystalline silicon as the experimental object,a pulse laser with a wavelength of 355 nm and the pulse duration of 15 ns was used to conduct ablation experiments to fabricate the square microstructure array.By the single factor experimental method,the nanosecond pulsed laser groove ablation experiment of monocrystalline silicon was designed and completed.The influence law of the laser output power,the pulse repetition rate,the laser scanning speed and the scanning times over the silicon surface morphology was explored.Based on the optimized processing parameters set,the microstructure of square arrays was fabricated on the surface of monocrystalline silicon.