直流电沉积Ni-W-P镀层研究

采用直流电沉积法,在低碳钢表面成功沉积Ni-W-P镀层。应用X射线荧光(XRF)、扫描电子显微镜(SEM)、俄歇电子能谱(AES)、X射线衍射(XRD)仪等方法,研究电流密度、镀液pH值和镀液温度对Ni-W-P镀层成分、表面形貌和结构的影响。结果表明,电流密度和镀液pH值的变化对Ni-W-P镀层成分的影响很大,而电流密度、镀液pH值和温度对镀层厚度的影响较小。电流效率随着电流密度和镀液温度的增大分别降低和升高,而随着镀液pH值的变化,在pH=7.0时有极大值。镀液pH值对Ni-W-P镀层结构有较大影响,在pH=8.0时,镀层呈现明显的Ni(111)峰,此时镀层硬度达到极大值7130MPa。在此基础上,对Ni-W-P镀层的电沉积机制做了进一步探讨。

Study on Direct-Current Electroplated Ni-W-P Layer

Ni-W-P layers were formed on a low-carbon steel substrate by direct-current electroplating method.The effects of current density,pH value and bath temperature on the composition,surface morphology,and microstructure of Ni-W-P layers were studied by X-ray fluorescence (XRF),scanning electron microscope (SEM),auger electron spectroscopy (AES) and X-ray diffraction (XRD).The results indicate that the change of current density and pH value influenced the composition of Ni-W-P layer greatly,but the change of cur...