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Etch characteristics of CoFeB magnetic thin films using high density plasma of a H2O/CH4/Ar gas mixture
Affiliation:1. Center for Modern Physics Technology, Applied Physics Department, School of Mathematics and Physics, Beijing Key Laboratory for Magneto-Photoelectrical Composite and Interface Science, University of Science and Technology, Beijing, Xueyan Road 30, Haidian District 100083, Beijing, China;2. Russian Quantum Center, Moscow 143025, Russia;3. Lomonosov Moscow State University, Moscow 119991, Russia;4. Guangdong Institute of Semiconductor Industrial Technology, Guangdong Academy of Sciences, Guangzhou 510650, China;1. Institute of Physical Chemistry “Ilie Murgulescu”, Romanian Academy, 202 Splaiul Independentei, 060021 Bucharest, Romania;2. Institute Jožef Stefan, Ljubljana, Slovenia;3. State Scientific and Production Association “Scientific-Practical Materials Research Center of the National Academy of Science Belarus, P. Brovska str.19, 220072, Minsk, Belarus;1. imec Belgium, Kapeldreef 75, 3001 Leuven, Belgium;2. now at Kaneka Belgium NV, Nijverheidsstraat 16, 2260 Westerlo-Oevel, Belgium
Abstract:Etch characteristics of CoFeB magnetic thin films patterned with TiN hard masks were investigated using inductively coupled plasma reactive ion etching in H2O/Ar and H2O/CH4 gas mixes. As the H2O concentration in the H2O/Ar gas increased, the etch rates of CoFeB and TiN films decreased simultaneously, while the etch selectivity increased and etch profiles improved slightly without any redeposition. The addition of CH4 to the H2O gas resulted in an increase in etch selectivity and a higher degree of anisotropy in the etch profile. X-ray photoelectron spectroscopy was performed to understand the etch mechanism in H2O/CH4 plasma. A good pattern transfer of CoFeB films masked with TiN films was successfully achieved using the H2O/CH4 gas mix.
Keywords:CoFeB magnetic thin films  Magnetic tunnel junction  MRAM  Inductively coupled plasma reactive ion etching
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