圆片清洗过程中静电控制

随着半导体技术的不断发展,对集成电路封装过程中的静电控制要求也越来越高。传统清洗机清洗圆片时,通常会产生大量的静电电压,可能引起芯片失效、损伤造成漏电流增大从而导致电路的损坏。如何降低清洗机清洗圆片时产生的静电电压,对减少封装过程中因ESD引起的芯片失效有着比较重要的意义。为此我们利用高压喷雾旋转清洗机针对圆片清洗这个步骤进行了一系列的试验。文中涉及控制清洗液的电阻率,并尝试改变清洗过程中的相关清洗条件,最终达到封装过程中要求的±200V的静电控制要求。

Electrostatic Protect in the Process of Silicon Wafer Cleaning

With the development of semiconductor technology,the requirement of electrostatic protect on IC packaging also becomes more and more strict.Traditional cleaner cleaning silicon wafer will always bring in electrostatic voltage.However it will easily cause chip defect or even damage.How to reduce electrostatic voltage in the process of cleaner cleaning silicon wafer has a great meaning on decrease chip defect during the assembly process caused by ESD.Experiments were done in this paper by controlling the resi...