| 热固性酚醛树脂移印标识牢固性研究 |
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| 引用本文： | 荆林晓,付明洋,冯小成,井立鹏,杨迪. 热固性酚醛树脂移印标识牢固性研究[J]. 电子与封装, 2020, 0(4): 23-25 |
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| 作者姓名： | 荆林晓 付明洋 冯小成 井立鹏 杨迪 |
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| 作者单位： | 北京时代民芯科技有限公司;中国电子技术标准化研究所 |
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| 摘 要： | 镀金盖板广泛应用于军品集成电路的气密性封装中,表面标识通常采用油墨移印方式进行打标。移印打标后的电路在经历表贴后易出现标识脱落的问题,导致用户无法辨认。通过研究移印打标过程中采用的热固性酚醛树脂油墨固化机理,确定了电路经历异常高温、助焊剂污染、清洗剂清洗及外力摩擦与标识牢固性的关系,有效指导了表贴厂家在后续表贴时的注意事项。
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| 关 键 词： | 镀金盖板 移印打标 标识牢固性 酚醛树脂 |
Study on Marking Firmness of Transfer Printing and Marking |
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| JING Linxiao,FU Mingyang,FENG Xiaocheng,JING Lipeng,YANG Di. Study on Marking Firmness of Transfer Printing and Marking[J]. Electronics & Packaging, 2020, 0(4): 23-25 |
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| Authors: | JING Linxiao FU Mingyang FENG Xiaocheng JING Lipeng YANG Di |
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| Affiliation: | (Beijing Times Minxin Technology Co.,Ltd.,Beijing 100076,China;China Electronic Standardization Institute,Beijing 100176,China) |
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| Abstract: | Gold-plated cover plates are widely used in air-tight packaging of military integrated circuits.Surface marking is usually marked by ink pad printing.However,after the circuit is marked by pad printing,the problem that the logo is apt to fall off after the surface is pasted causes the user to fail to recognize it.By studying the curing mechanism of the thermosetting phenolic resin ink used in the pad printing process,the relationship between the circuit experiencing abnormal high temperature,flux contamination,cleaning agent cleaning and external friction and the firmness of the logo was determined,which effectively guided the surface mount manufacturers in precautions for subsequent surface mount. |
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| Keywords: | gold-plated cover plates marked by pad printing firmness of the logo phenolic resin |
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