| Cu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长 |
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| 引用本文： | 何洪文,徐广臣,郭福.Cu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长[J].金属学报,2009,45(6):744-748. |
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| 作者姓名： | 何洪文 徐广臣 郭福 |
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| 作者单位： | 北京工业大学材料科学与工程学院,北京,100124 |
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| 基金项目： | 新世纪优秀人才支持计划资助项目04--0202 |
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| 摘 要： | 利用SEM和EDS研究了Cu/Sn--58Bi/Cu焊点在电流密度为5×103 A/cm2, 80℃条件下晶须和小丘的生长. 通电540 h后, 在焊点阴极界面区出现了钎料损耗, 同时形成了晶须, 而在阳极Cu基板的钎料薄膜上形成了大量弯曲状晶须和块状小丘. EDS检测表明, 这些 晶须和小丘为Sn和Bi的混合物. 通电630 h后, 阳极上的晶须和小丘数量明显增多, 原来形成晶须的尺寸和形状没有变化, 阴极界面处 形成Cu6Sn5金属间化合物. 上述现象表明: 电迁移引发了金属原子的扩散迁移, 从而在阳极Cu基板上形成了一层钎料薄膜. 钎料薄膜中金属间化合物的形成导致压应力的产生, 促使晶须和小丘生长, 而阴极钎料损耗区域内晶须的形成与Joule热聚集有关.
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| 关 键 词： | 电迁移 晶须 金属间化合物 压应力 Joule热 |
| 收稿时间： | 2008-11-19 |
| 修稿时间： | 2009-03-31 |
FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATION |
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| HE Hongwen,XU Guangchen,GUO Fu.FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATION[J].Acta Metallurgica Sinica,2009,45(6):744-748. |
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| Authors: | HE Hongwen XU Guangchen GUO Fu |
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| Affiliation: | Beijing University of Technology, School of Materials Science and Engineering, Beijing 100124 |
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| Abstract: | With the trends of higher integration and microminiaturization in electronic packaging, the sizes of the soldered joints are becoming smaller and smaller.The corresponding current density in the soldered joints can easily reach 10~3A/cm~2 or higher,which makes the electromigration(EM) much more prominent.EM will lead to the atoms to pile up at the anode side and produce voids or cracks at the cathode side.Furthermore,with the stressing time increasing,these voids or cracks will propagate gradually resulting... |
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| Keywords: | electromigration whisker intermetallics compressive stress Joule heating |
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